Pardeep Shahi
Senior Mechanical Engineer
NVIDIA

Monday, June 9, 2025
1:30 P.M. – 2:30 P.M.
Panel: Dirty Insights on Liquid Cooling Commissioning TCS Pipe System and Liquid Cooled ITE (session)

Wednesday, June 11, 2025
10:15 A.M. – 11:15 A.M.
Fluid to Chip Cooling Systems – Can You Handle the Heat? (session)

Pardeep Shahi is a Senior Mechanical Engineer at NVIDIA, specializing in thermal and liquid cooling solutions for data centers and IT equipment. With a Ph.D. in Mechanical Engineering from the University of Texas at Arlington, he has led pioneering research in single-phase cold plate and immersion cooling technologies. Pardeep has played a crucial role in developing NVIDIA’s CDU requirements and liquid-cooled data center reference designs, collaborating globally on cutting-edge thermal management solutions. He holds multiple patents in data center cooling systems, focusing on adaptive control, flow regulation, and efficiency optimization. His expertise spans CFD analysis, Data Center TCS loop Design, CDUs, and control strategies. Recognized with ASME InterPack Best Paper award and InterPack Intel outstanding paper awards, he actively contributes to industry conferences, research publications, and mentoring young engineers. Passionate about innovative cooling solutions, Pardeep continues to push the boundaries of energy-efficient and high-performance thermal systems in modern data centers.