Wednesday, June 11
10:15 AM – 11:15 AM
Panel:
Fluid to Chip Cooling Systems – Can You Handle the Heat?
This session explores the many challenges and nuances of technical cooling systems (TCS) that are becoming prevalent in today’s data center designs. As the data center industry has not executed these at this unprecedented scale, it’s important to understand the WHY behind the many significant design requirements they are not trivial and can land you in hot water if you’re not careful!
Moderator
Justin Seter (bio)
Executive Director of Strategic Initiatives
DLB Associates
Panelists: